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1 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 benefts ? surface mount form factor ? operating a mbient t emperature o f ? 55c t o + 125c ? op erating voltage range of up to 18 vdc ? av ailable cases sizes: 0603, 0805, 1206, 1210 ? sh ort response time ? ch aracterized for inductance and capacitance ? di mensional and weight savings on the board ? non-sensitive t o mi ldly a ctivated f uxes ? ba rrier type end terminations solderable with pb-free solders according to jedec jCstdC020c and iec 60068C2C58 ? non-plastic c oating g uarantees i mproved fa mmability ra ting ? av ailable in tape and reel for automatic pick and place ? ul 1 499, 3rd edition and csa c22.2 file e326499 section 8 ? ro hs 2 2011/65/ec, reach compliant ? aec-q200 qu alifed g rade 1 overview kemet's vg series of varistors are designed to suppress esd e vents, including those specifed in iec 1000-4-2 or other standards used for electr omagnetic compliance testing. vg varistors are typically applied to protect integrated circuits and other components at the circuit board level operating at 18 vdc or less. the manufacturing method, design and materials of these devices result in capacitance characteristics suitable for high fr equency attenuation/low-pass flter cir cuit functions, pro viding suppr ession and fltering in a single de vice. applications typical applications include the protection of components and circuits sensitive to esd transients occurring on power supply, control and signal lines in mobile communication, computer/edp products, medical products, hand held/ portable devices, industrial equipment, including diagnostic port protection and i/o interfaces. suppression of esd e vents as specifed in iec 1000-4- 2, milstd 883c, method 3015.7 or aec-q200-002 for electr omagnetic compliance (emc). surface mount varistors vg series esd suppression 125c one world. one kemet
2 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 ordering information vg 0603 s 020 r 014 series chip size code tolerances rated peak single pulse transient current (a) packaging/ termination maximum continuous working voltage (vrms ac) varistor smd 1 25c esd suppression multilayer chip 0603 = 0603 0805 = 0805 1206 = 1206 1210 = 1210 s = special 020 = 2 amps (first two digits represent signifcant f gures. t hird d igit sp ecifes n umber o f z eros.) r = reel 180 mm/ni sn barrier terminations 014 = 14 dimensions C millimeters 525 t size code l w t max 0603 1.60.20 0.800.10 0.95 0805 2.00.25 1.250.20 0.95 1206 3.20.30 1.600.20 1.20 1210 3.20.30 2.500.25 1.30 environmental compliance rohs 2 2011/65/ec, reach surface mount varistors vg series esd suppression 125c
3 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 performance characteristics continuous units value steady state applied voltage dc voltage range (v dc ) v 18 ac voltage range (v rms ) v 14 transient non-repetitive surge current, 8/20 s waveform (i max ) a 20 to 30 non-repetitive surge energy, 10/1000 s waveform (w max ) j 0.05 to 0.1 operating ambient temperature c ?55 t o + 125 storage temperature range c ?55 t o + 150 threshold v oltage t emperature c oeffcient %/c < +0 .05 response time ns < 2 climatic category 55/125/56 qualifcations reliability parameter test tested according to condition to be satisfed after testing ac/dc bias reliability ac/dc life test cecc 42200, test 4.20 or iec 1051C1, test 4.20. aecCq200 test 8 C 1,000 hours at uct | vn (1 ma)| < 10 % pulse current capability i max 8/20 s cecc 42200, test c 2.1 or iec 1051C1, test 4.5. 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses | vn (1 ma)| < 10 % no visible damage pulse energy capability w max 10/1,000 s cecc 42200, test c 2.1 or iec 1051C1, test 4.5. 10 pulses in the same direction at 1 pulses every 2 minutes at maximum peak current for 10 pulses | vn (1 ma)| < 10 % no visible damage wld capability wld x 10 iso 7637, test pulse 5, 10 pulses at rate 1 per minute | increase o f s upply vo ltage t o v v jump for 1 minute | surface mount varistors vg series esd suppression 125c
4 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 qualifcations cont'd reliability parameter test tested according to condition to be satisfed after testing environmental and storage reliability climatic sequence cecc 42200, test 4.16 or iec 1051C1, test 4.17. a) dry heat, 16 hours, uct, test ba, iec 68C2C2 b) d amp h eat, c yclic, t he f rst c ycle: 5 5c, 9 3 % r h, 24 h ours, test db 68C2C4 c) cold, lct, 2 hours test aa iec 68C2C1 d) d amp h eat c yclic, r emaining 5 c ycles: 5 5c, 9 3 % rh , 24 hour/cycle, test bd, iec 68C2C30 | vn (1 ma)| < 10 % thermal shock cecc 42200, test 4.12, test na, iec 68C2C14, aecCq200 test 16, 5 cycles uct/lct, 30 minutes | vn (1 ma)| < 10 % no visible damage steady state damp heat cecc 42200, test 4.17, test ca, iec 68C2C3, aecCq200 t est 6 , 5 6 d ays, 4 0c, 9 3% r h. a ecCq200 te st7: bias, rh, t all at 85. | vn (1 ma)| < 10 % storage test iec 68C2C2, test ba, aecCq200 test 3, 1,000 hours at maximum storage temperature | vn (1 ma)| < 5 % mechanical reliability solderability cecc 42200, test 4.10.1, test ta iec 68C2C20 solder b ath a nd r efow m ethod solderable at shipment and after 2 year of storage, criteria > 95% must be covered b y s older f or r efow me niscus resistance to soldering heat cecc 42200, test 4.10.2, test tb, iec 68C2C20 solder bath a nd r efow m ethod | vn (1 ma)| < 5 % terminal strength jisCcC6429, app. 1, 18n for 60 seconds C same for aecCq200 test 22 no visual damage board flex jisCcC6429, app. 2, 2 mm minimum aecCq200 t est 2 1 C b oard f ex: 2 m m f ex m inimum | vn (1 ma)| < 2 % no visible damage vibration cecc 42200, test 4.15, test fc, iec 68C2C6, aecC q200 test 14. frequency range 10 to 55 hz (aec: 10 C 2,000 hz) amplitude 0.75 m/s2 or 98 m/s2 (aec: 5 g's for 20 minutes) total duration 6 hours (3x2h) (aec: 12 cycles each of 3 directions) waveshape C half sine | vn (1 ma)| < 10 % no visible damage mechanical shock cecc 42200, test 4.14, test ea, iec 68C2C27, aecCq200 test 13. acceleration = 490 m/s2 (aec: mil-stdC202Cmethod 213), pulse duration = 11 ms, waveshape C half sine; number of shocks = 3x6 | vn (1 ma)| < 10 % no visible damage electrical transient conduction isoC7637C1 pulses aecCq200 test 30: test pulses 1 to 3. also other pulses C freestyle. | vn (1 ma)| < 10 % no visible damage surface mount varistors vg series esd suppression 125c
5 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 reliability in general, reliability is the ability of a component to perform and maintain its functions in routine circumstances, as well as hostile or unexpected circumstances. the mean life of series components is a function of: ? fa ctor of applied voltage ? am bient temperature mean life is closely related to failure rate (formula). mean life (ml) is the arithmetic mean (average) time to failure of a component. failure rate is the frequency with which an engineered system or component fails, expressed for example in failures per hour. failure rate is usually time dependent, an intuitive corollary is that the rate changes over time versus the expected life cycle of a system. failure rate formula C calculation = 10 9 [ft] ml[h] fav C factor of applied voltage = vapl v max vapl = applied voltage v max = maximum operating voltage table 1 C ratings & part number reference kemet part number l (mm) w (mm) t max (mm) v rms vdc v n 1 ma v c 8/20 s i c 8/20 s (a) w max 10/1000 s (j) p max (w) c typ at 1 khz (pf) l typ 100 ma/ns (nh) vg0603s020r014 1.6 0.20 0.80 0.10 0.95 14 18 22 - 28 50 2 0.05 0.003 75 < 1.0 vg0805s020r014 2.0 0.25 1.25 0.20 0.95 14 18 22 - 28 50 2 0.10 0.004 100 < 1.5 VG1206S020R014 3.2 0.30 1.60 0.20 1.20 14 18 22 - 28 50 2 0.10 0.004 200 < 1.8 vg1210s020r014 3.2 0.30 2.50 0.25 1.30 14 18 22 - 28 50 2 0.10 0.004 400 < 3.5 years mean life on arrhenius model 1,000 100 10 10 3 10 4 10 5 10 6 10 7 10 8 1 h 120 100 80 60 40 20 c t a mean life (ml) fav 0,7 0,8 0,9 1,0 surface mount varistors vg series esd suppression 125c
6 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 soldering popular soldering techniques used for surface mounted components are wave and infrared refow processes. both processes can be performed with pb-containing or pb-fr ee solders. the termination option available for these soldering techniques is barrier type end terminations. end termination designation recommended and suitable for component rohs compliant ni sn barrier type end termination ni r1 pb-containing and pb-free soldering yes wave soldering C this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. smd v aristors t o be wa ve solder ed ar e frst glued t o the cir cuit boar d, usually with an epo xy adhesiv e. when all components on the pcb hav e been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. infrared refow soldering C these r efow pr ocesses ar e typically associated with t op-side component placement. this technique utiliz es a mixtur e of adhesiv e and solder compounds (and sometimes fux es) that ar e blended int o a paste. the paste is then scr eened ont o pcb soldering pads specifcally designed t o accept a par ticular siz ed smd component. the r ecommended solder paste wet la yer thickness is 100 t o 300 m. once the cir cuit boar d is fully populated with md components, it is placed in a r efow envir onment, wher e the paste is heated t o slightly abo ve its eutectic temper ature. when the solder paste r efows, the smd components ar e attached t o the solder pads. solder flux es C solder fux es ar e gener ally applied t o populated cir cuit boar ds t o clean o xides forming during the heating pr ocess and t o facilitate the fowing of the solder . solder fux es can be either a par t of the solder paste compound or can be separ ate materials, usually fuids. recommended fux es ar e: ? non-activ ated (r) fux es, whene ver possible ? mildly activ ated (rm a) fux es of class l3cn ? class orlo activated (ra), water soluble or str ong acidic fux es with a chlorine content > 0.2 wt. % ar e no t recommended . the use of such fux es could create high leakage curr ent paths along the body of the varistor components. when a fux is applied prior t o wa ve soldering, it is impor tant t o completely dr y any r esidual fux solv ents prior t o the soldering pr ocess. thermal shock C to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 c of the peak soldering pr ocess temper ature is r ecommended. additionally , smd v aristors should not be subjected t o a temper ature gradient gr eater than 4 c/sec., with an ideal gr adient being 2 c/sec. p eak temper atures should be contr olled. w ave and refow soldering conditions for smd v aristors with pb-containing solders are shown in fig. 1 and 2 respectiv ely, while wa ve and refow soldering conditions for smd varist ors with pb-free solders are shown in fig, 1 and 3 surface mount varistors vg series esd suppression 125c
7 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 soldering cont'd whenever several different types of smd components are being soldered, each having a specifc soldering profle, the soldering profle with the least heat and the minimum amount of heating time is recommended. once soldering has been completed, it is necessar y to minimize the possibility of thermal shock b y allowing the hot pcb t o cool t o less than 50 c befor e cleaning. inspection criteria C the inspection criteria t o determine acceptable solder joints, when w ave or infr ared refow pr ocesses ar e used, will depend on se veral k ey v ariables, principally termination material pr ocess pr ofles. pb-contining wave and ir refow soldering C typical before and after soldering results for barrier type end terminations can be seen in fig. 4. barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. the bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. the results exceed established industry standards for adhesion. the solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume climbs the outer surface of the terminations, the meniscus will be slightly lower. this optical appearance should be taken into consideration when programming visual inspection of the pcb after soldering. ni sn barrier type end terminations fig. 4 C soldering criterion in case of wave and ir refow pb-containing soldering pb-free w ave and ir refow soldering C typical before and after soldering results for barrier type end terminations are given in a phenomenon knows as mirror or negative meniscus. solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a mirror or negative meniscus. the height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height. surface mount varistors vg series esd suppression 125c
8 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 soldering cont'd solder test and retained samples C r efow soldering test based on j-std-020d .1 and soldering test b y dipping based on iec 60068- 2 for pb-fr ee solders are preformed on each production lot as shown in the following chart. test results and accompanying samples are r etained for a minimum of two (2) y ears. the solder ability of a specifc lot can be check ed at any time within this period should a customer r equire this information. test resistance to flux solderability static leaching (simulation of refow soldering) dynamic leaching (simulation of wave soldering) parameter soldering method dipping dipping dipping dipping with agitation flux l3cn, orl0 l3cn, orl0, r l3cn, orl0, r l3cn, orl0, r pb solder 62sn/36pb/2 ag pb so ldering te mperature ( c) 2355 2355 2605 2355 pb-free solder sn96/cu0,4C0,8/3C4ag pb-free soldering temperature ( c) 2505 2505 2805 2505 soldering time (s) 2 210 10 > 15 burn-in conditions vdc max , 48 h acceptance criterion dvn < 5 %, i dc must stay unchanged > 95 % of end termination must be covered by solder > 95 % of end termination must be intact and covered by solder > 95 % of end termination must be intact and covered by solder rework criteria soldering iron C unless absolutely necessary, the use of soldering irons is not recommended for reworking varistor chips. if no other means of rework is available, the following criteria must be strictly followed: ? do not allow the tip of the iron to directly contact the top of the chip ? do not ex ceed the following soldering ir on specifcations: output power: 30 watts maximum temperature of soldering ir on tip: 280c maximum soldering time: 10 seconds maximum stor age conditions C smd varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. the st orage envir onment should be contr olled, with humidity less than 40% and temper ature between -25 and 45 c. v aristor chips should always be st ored in their original packaged unit. surface mount varistors vg series esd suppression 125c
9 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 soldering pad confguration w l t m b c b a d a size l (mm) w (mm) h (mm) t max (mm) a (mm) b (mm) c (mm) d (mm) 0603 1.60.20 0.800.10 0.50.25 1.0 1.0 1.0 0.6 2.6 0805 2.00.25 1.250.20 0.50.25 1.1 1.4 1.2 1.0 3.4 1206 3.20.30 1.600.20 0.50.25 1.6 1.8 1.2 2.1 4.5 1210 3.20.30 2.500.25 0.50.25 1.8 2.8 1.2 2.1 4.5 packaging voltage range (v) chip size 0603 0805 1206 1210 6iip7mi 180 180 180 180 14 4000 4000 4000 4000 surface mount varistors vg series esd suppression 125c
10 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 construction glass passivation detailed cross section inner electrodes (ag) terminate edge terminate edge zno layer inner electrodes (ag) glass passivation termination (ag/pd, ni/sn) termination (ag/pd, ni/sn) surface mount varistors vg series esd suppression 125c
11 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 taping & reel specifcations tape size (mm) 8 mm 0603 0805 1206 1210 ao 1.2 1.6 1.9 2.9 bo 1.9 2.4 3.75 3.7 ko maximum 1.1 1.1 1.8 2 b 1 maximum 4.35 4.35 4.35 4.35 d 1 minimum 0.3 0.3 0.3 0.3 e 2 minimum 6.25 6.25 6.25 6.25 p 1 4 4 4 4 f 3.5 3.5 3.5 3.5 w 8.0 8.0 8.0 8.0 t 2 maximum 3.5 3.5 3.5 3.5 w 1 8.4+1.5 8.4+1.5 8.4+1.5 8.4+1.5 w 2 maximum 14.4 14.4 14.4 14.4 w 3 7.9...10.9 7.9...10.9 7.9...10.9 7.9...10.9 a 180 180 180 180 surface mount varistors vg series esd suppression 125c
12 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 terms and defnitions term symbol defnition rated ac voltage v rms maximum continuous sinusoidal ac voltage (<5% total harmonic distortion) which may be applied t o t he c omponent u nder c ontinuous o peration c onditions a t 2 5c rated dc voltage v dc maximum continuous dc voltage (<5% ripple) which may be applied to the component under continuous operating conditions at 25c the current passing through the varistor at vdc and at 25c or at any other specifed temperature varistor voltage v n voltage across the varistor measured at a given reference current in reference current i n reference current = 1 ma dc clamping voltage protection level v c the peak voltage developed across the varistor under standard atmospheric conditions, when passing an 8/20 s class current pulse minute for the 8/20 s pulse a fgure of merit measure of the varistor clamping effectiveness as defned by the symbols v c /v app , where (v app = v rms or v dc ) jump start transient v jump the jump start transient resulting from the temporary application of an overvoltage in excess of the rated battery voltage. the circuit power supply may be subjected to a temporary overvoltage condition due to the voltage regulation failing or it may be deliberately generated when it becomes necessary to boost start the car rated single pulse transient energy w max energy which may be dissipated for a single 10/1000 s pulse of a maximum rated current, with rated ac voltage or rated dc voltage also applied, without causing device failure load dump transient wld load dump is a transient which occurs in an automotive environment. it is an exponentially decaying positive voltage which occurs in the event of a battery disconect while the alternator is still generating charging current with other loads remaining on the alternator circuit at the time of battery disconect rated peak single pulse transient current i max maximum peak current which may be applied for a single 8/20 s pulse, with, rated line vol tage also applies, without causing device failure rated transient average power dissipation p maximum average power which may be dissipated due to a group of pulses occurring within a specifed i solated t ime p eriod, w ithout c ausing d evice f ailure a t 2 5c capacitance c capacitance between two terminals of the varistor measured at at 1 khz response time tr the time lag between application of a surge and varistor's "turn-on" conduction action varistor voltage temperature coeffcient at 85c C v n at 25c)/(v n at 25c) x 60c) x 100 in sulation resistance ir minimum resistance between shorted terminals and varistor surface isolation voltage the maximum peak voltage which may be applied under continuous operating conditions between the varistor terminations and any conducting mounting surface operating temperature the range of ambient temperature for which the varistor is designed to operate continuously as defned by the temperature limits of its climatic category surface mount varistors vg series esd suppression 125c
13 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v0 004_vg ? 10/26/2016 kemet electronic corporation sales off ces for a complete list of our global sales off ces, please visit www.kemet.com/sales. disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. /)1)8mwevikmwivihvehiqevosj/)1)8)pigvsrmgw'svtsvemsr surface mount varistors vg series esd suppression 125c

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